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3D BGA Reballing Stencil Kit For Motherboard Middle Layer Planting Tin Template Reballing Plate Soldering Net

3D BGA Reballing Stencil Kit For Motherboard Middle Layer Planting Tin Template Reballing Plate Soldering Net

Name: 3D BGA Reballing Stencil Kit For Motherboard Middle Layer Planting Tin Template Reballing Plate Soldering Net
Brand: Hhwj
Price: 1857.64 SCR
Availability: InStock

Product ID: 155816460

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Frequently Bought Together

Description

Particle Size:1-10Μm
Usage:Repair For Iphone X
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Particle Size:1-10ΜmUsage:Repair For Iphone X

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TrustScore 4.5 | 7,300+ reviews

Ali H.

Fast shipping and excellent packaging. The Leatherman tool feels very premium and sturdy.

1 day ago

Pooja R.

The customer service exceeded my expectations. Perfect for buying products you can't find elsewhere.

1 week ago

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₨1857

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Trustpilot

TrustScore 4.5 | 7,300+ reviews

Anjali K.

The product quality is outstanding. Exactly what I needed for my work.

1 month ago

Ayesha M.

The product exactly matches the description. Very satisfied with my purchase.

5 days ago

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