Mix Ratio by weight: 100:22.5 / Resin:Hardener Substrates: Ceramics, glass to glass, fabrics, metals, laminates and other composite materials Operating Temperature: -60 to 130 C Typical Application: critical electronics, aerospace, and industrial applications where a high-fill, non-sag reliable adhesive is required for bonding and enhancing the mechanical and structural rigidity of assemblies Specific Gravity: 1.25 Reactive solids contents, %: 100 Pot Life: 30 minutes Viscosity: 100,000 4 hours: @ 65C 24 hours: @ 25C Volume Resistivity: 6.00e+13 ohm-cm Dielectric Constant: 4.5 Dielectric Strength: 410 kV/mil Hardness, Shore D: 88 Strong-Bond 116 Low Vapor Pressure, Epoxy Staking Compound, 2 Part, Passes NASAs Outgassing is a thixotropic, low vapor pressure epoxy system that passes the NASA Outgassing Specification. It is recommended for critical electronics, aerospace, and industrial applications where a high-fill, non-sag reliable adhesive is required for bonding and enhancing the mechanical and structural rigidity of assemblies.Strong-Bond 116 Low Vapor Pressure, Epoxy Staking Compound, 2 Part, Passes NASAs Outgassing is two-part, solvent-free compound is readily mixed, handled, used, and cured at room temperature, and develops strong bonds to most clean, dry material surfaces including metals, glass, ceramics, wood and many plastics.Strong-Bond 116 Low Vapor Pressure, Epoxy Staking Compound, 2 Part, Passes NASAs Outgassing bonds provide electrical insulation and excellent resistance to weather, galvanic action, petroleum solvents and lubricants, gasoline, jet fuels, alcohol, salts, and mild acids and alkalis.For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).1) Carefully clean and dry all surfaces to be bonded.2) Apply this completely mixed adhesive to the prepared surfaces, and gently press these surfaces together. Contact pressure is adequate for strong, reliable bonds; how
Trustpilot
1 month ago
1 month ago
