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3D BGA Reballing Stencil Kit For Motherboard Middle Layer Planting Tin Template Reballing Plate Soldering Net

3D BGA Reballing Stencil Kit For Motherboard Middle Layer Planting Tin Template Reballing Plate Soldering Net

Name: 3D BGA Reballing Stencil Kit For Motherboard Middle Layer Planting Tin Template Reballing Plate Soldering Net
Brand: Hhwj
Price: 1857.64 SCR
Availability: InStock

Product ID: 155816460

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Frequently Bought Together

Description

Particle Size:1-10Μm
Usage:Repair For Iphone X
›See more product details

Particle Size:1-10ΜmUsage:Repair For Iphone X

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Trustpilot

TrustScore 4.5 | 7,300+ reviews

Farhan Q.

The delivery time was excellent, and the packaging was secure.

2 months ago

Zainab N.

Fantastic and great service. Shipping was faster than expected.

1 week ago

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₨1857

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Trustpilot

TrustScore 4.5 | 7,300+ reviews

Abdullah B.

Great price for an authentic product. Fast international shipping too!

3 weeks ago

Meera L.

Smooth transaction and product arrived in perfect condition.

3 weeks ago

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